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Dimensions
Signal Relays
FT2/FU2 Relay (Continued)
AXICOM
THT version
SMT, long terminals
SMT, short terminals
7.5±0.05
15.0±0.05 15.0±0.05 15.0±0.05
7.5±0.05
7.5±0.05
15.0±0.05 15.0±0.05 15.0±0.05 7.5±0.05
7.5±0.05
7.5±0.05
15.0±0.05 15.0±0.05 15.0±0.05 7.6±0.05
7.6±0.05
7.6±
coplanarity ≤0.1mm
coplanarity ≤0.1mm
coplanarity ≤0.1mm
coplanarity ≤0.1mm
coplanarity ≤0.1mm
coplanarity ≤0.1mm
0.5
0.5
0.5
5.08
5.08
5.08
0.5 0.5 0.5 5.08
9.2±0.2
5.08
9.2±0.2
5.08
9.2±0.2
0.5 0.5 0.5 5.08
7.5±0.2
5.08
7.5±0.2
5
7.5
Processing
Vapour phase soldering
Recommended soldering conditions
20 to 40s
240°C
180°C
130°C
external preheating
full line: typical
dotted line: process limits
forced cooling
100°C
Vapour phase soldering
temperature/time pro?le
(lead and housing peak temp.)
Time [s]
Recommended re?ow soldering pro?le
Infrared soldering
temperature/time pro?le
(lead and housing peak temp.)
Time [s]
08-2013, Rev. 0813
www.te.com
? 2013 Tyco Electronics Corporation,
a TE Connectivity Ltd. company
Datasheets and product specification
according to IEC 61810-1 and to be used
only together with the ‘Definitions’ section.
Datasheets and product data is subject to the
terms of the disclaimer and all chapters of
the ‘Definitions’ section, available at
http://relays.te.com/definitions
Datasheets, product data, ‘Definitions’ sec-
tion, application notes and all specifications
are subject to change.
3
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